Technology Transfer SSC Pacific
Flexible Video Display 
 

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The U.S. Navy seeks to commercialize U.S. Patent 7,274,413 (Flexible video display apparatus and method). 

Background

Flexible video displays are similar to traditional, flat video displays, but are thin enough to be flexible and bend. They have commercial applications in entertainment, medicine, training, and defense; and can be attached to curved surfaces for more realistic virtual reality training, used as heads-up displays in wearable computer systems, or used to display electronic maps that can be rolled up in a back pocket. Traditional flexible display technologies typically do not integrate electronics directly on the display layer, instead they use complex interconnections. In the few cases where electronics are integrated, the materials used do not support high-performance electronics such as video due to their poor crystalline structure.

The Technology

SSC Pacific has developed a method and apparatus for a flexible video display that is made of extremely thin layers of polymers or other synthetic materials, and overcomes the integration limitations by using single crystal silicon to form the electronics layer. The method covers the use of a light-emitting layer that can be used to produce images when voltage is applied by the electronics layer. Electronics can be added for additional capabilities such as wireless transmission or video signal. Integrating the video display with high-performance electronics on a single chip allows for full-motion video capabilities, wireless transfer of information without the need for complex interconnections, and reduced overall power consumption. As a window rattles and bends without breaking in a windstorm, this thin-layer technology allows the flexible video display to bend without breaking.

Key Benefits

  • High-performance electronic components integration capability allows for improvement in display performance and functionality
  • Lower power operation due to single crystal silicon on an insulating layer
  • Decreased integration complexity due to direct integration of electronics onto the display layer
  • Increased range of useful applications due to flexibility, including highly portable environments
  • Lower cost due to coupling electronics layers on one single chip rather than many
  • Development Status

  • U.S. Patent issued: 7,274,413
  • Total R$D: $7-10M and 8 years
  • DoD 5000 Series Technology Readiness Level 3: Analytical and experimental critical function and/or characteristic proof of concept
  • For more information on technology transfer, please contact us at (619) 5535118 or email ssc_pac_t2@navy.mil
    SD 783, March 2008. SSC Pacific, San Diego, CA 921525001. Approved for public release; distribution is unlimited.

    SSC Pacific
    1/1/2015 
    Updated: 1/8/2015 4:55 PM EST   Published (1.0)